Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 11, 2009
Patent Application Number
11765019
Date Filed
June 19, 2007
Patent Primary Examiner
Patent abstract
A method is disclosed for measurement of wafers and other semiconductor components in a probe station, which serves for examination and testing of electronic components. The device under test is held by a chuck and at least one electric probe by a probe support and the device under test and the probe are selectively positioned relative to each other by a positioning device with electric drives and the device under test is contacted. The drive of the positioning device remains in a state of readiness until establishment of contact and is switched off after establishment of contact and before measurement of the device under test.
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