Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 18, 2009
Patent Application Number
11398048
Date Filed
April 5, 2006
Patent Primary Examiner
Patent abstract
An electrolytic copper plating process comprising two steps is proposed. The process is particularly suited to plating in very confined spaces. The first step comprises a pre-treatment solution comprising an anti-suppressor that comprises a sulfur containing organic compound, preferably incorporating an alkane sulfonate group or groups and/or an alkane sulfonic acid. The second step comprises an electrolytic copper plating solution based on an alkane sulfonic acid.
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