Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 25, 2009
Patent Application Number
10538281
Date Filed
November 17, 2003
Patent Primary Examiner
Patent abstract
A method and apparatus are discloses for wirebonding leads of a plurality of lead frames being part of a lead frame assembly by a wirebonding tool to semiconductor products mounted on the respective lead frames. The semiconductor products are clamped by a clamping mechanism comprising a stationary clamp and a movable clamp. The movable clamp follows the indexing movement of the lead frame assembly during wirebonding of the semiconductor products clamped by the movable clamp. The wirebonding process does not need to be interrupted for the indexing.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
