An etching composition for non-conductive substrates such as polyester, polyether, polyimide, polyurethane, epoxy resin, polysulfone, polyethersulfone, polyetherimide, and polyamide, comprising a halogenide and/or nitrate of a metal selected from the group consisting of Na, Mg, Al, Si, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Ca, Zn, and combinations thereof such as FeCl3, FeCl2, TiCl3, CaCl2, CuCl2, CrCl3, ZnCl2, MgCl2, MnCl2, and Cr(NO3)3; and a related method for etching.