Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 25, 2009
Patent Application Number
10815932
Date Filed
April 2, 2004
Patent Citations Received
Patent Primary Examiner
Patent abstract
Disclosed is a method of manufacturing a semiconductor device, comprising forming a metal compound film directly or indirectly on a semiconductor substrate, forming a metal-containing insulating film consisting of a metal oxide film or a metal silicate film by oxidizing the metal compound film, and forming an electrode on the metal-containing insulating film.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
