Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
August 25, 2009
Patent Application Number
10934113
Date Filed
September 3, 2004
Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor die includes a plurality of interconnection pads for connecting with a memory die. The two dies are packaged together in a stacked manner. The plurality of pads are disposed so that the circuit layout of the semiconductor die is invariable with respect to the size of the memory die within a given range of sizes.
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