Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 25, 2009
Patent Application Number
12122496
Date Filed
May 16, 2008
Patent Primary Examiner
Patent abstract
An electrostatic chuck structure according to example embodiments of the present invention may include at least one specific region of a conductor having a thickness relatively smaller than those of other regions, at least one specific region of a dielectric having a thickness relatively larger than those of other regions, or at least one specific region of a conductor having a thickness relatively smaller than those of other regions and at least one specific region of a dielectric having a thickness relatively larger than those of other regions. Therefore, etching rate and CD uniformity can be improved during a semiconductor manufacturing process.
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