Patent 7581964 was granted and assigned to Yazaki on September, 2009 by the United States Patent and Trademark Office.
A unit with a built-in control circuit includes an outer housing and a control circuit package. The outer housing includes an electric wire holding part and receives the control circuit package. The control circuit package includes a lead frame, an IC chip, and a plastic molding body. The lead frame is made of conductive metal, and includes crimping terminals 20 and male tabs. The electric wire is press-fitted into the crimping terminal. The male tabs are connected to a mating connector. The IC chip is mounted on the lead frame. The plastic molding body covers and receives the IC chip and a center part of the lead frame.