Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kwan Yul Lee0
Date of Patent
September 1, 2009
0Patent Application Number
113208610
Date Filed
December 30, 2005
0Patent Primary Examiner
Patent abstract
A printed circuit board including an opening for receiving a semiconductor package having a plurality of external connections which protrude externally from side surfaces of the semiconductor package. The board also includes a plurality of board connectors electrically interconnected to the plurality of external connections of the package and formed on sidewall of the opening, wiring patterns for electrically interconnect electronic components mounted on the printed circuit board and being electrically interconnected to the plurality of board connectors, a plurality of holes penetrating the printed circuit board, and a fastener inserted into the plurality of holes and for fastening the semiconductor package received in the opening.
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