Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
David A. Chan0
Sanjay Rajaram0
Boguslaw A. Swedek0
Bret W. Adams0
Manoocher Birang0
Date of Patent
September 8, 2009
0Patent Application Number
119230820
Date Filed
October 24, 2007
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A computer-implemented method for process control in chemical mechanical polishing in which an initial pre-polishing thickness of a substrate is measured at a metrology station, a parameter of an endpoint algorithm is determined from the initial thickness of the substrate, a substrates is polished at a polishing station, and polishing stops when an endpoint criterion is detected using the endpoint algorithm.
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