Patent attributes
A plunger is suitable for a chip-testing module having a probe card, which has a circuit board and a membrane. The membrane has a circuit layer disposed on a first membrane surface of the membrane, conductive through-vias penetrating the membrane, and bumps disposed on a second membrane surface opposite to the first membrane surface, located in a pushed area of the membrane, and electrically connected to the circuit layer through the conductive through-vias. The plunger includes a body having a pushing part and a base part and a conductive layer disposed on a surface of the pushing part and the base part. Part of the circuit layer located in the pushed area is suitable for contacting and being electrically connected to part of the conductive layer located on the pushing part. The bumps are electrically connected to the conductive layer through the conductive through-vias.
