US Patent 7586964 Laser package and laser module

A laser package has at least one laser device and a hermetically sealed package including a package base and a cap having a light transmissive window for emitting light. The at least one laser device is placed in the package and fixed onto the package base. Further, a plurality of lead pins including a lead pin for supplying drive current to the laser device projects from the package base. Further, surface insulating processing has been performed on a projecting portion of at least one of the lead pins. The projecting portion is a portion which projects from the package base to the outside of the laser base.