A contact arrangement for connecting an electrode line to an implantable device, comprises an electrical connecting socket with a socket longitudinal axis and at least one opening for the insertion of a plug along the socket longitudinal axis. The arrangement includes at least one electrically conductive spring contact element, arranged and adapted to deflect resiliently elastically outwardly upon insertion of a plug, by compression in a spring deflection direction extending transversely with respect to the socket longitudinal axis and providing a spring force acting in opposition to the compression. The arrangement has a spring contact element with an integral metallic spring contact tongue, with spring contact tongue portions which extend transversely with respect to the spring deflection direction and which are connected together by turn portions. The turn portions occurring in immediate succession in the spring deflection direction are turned towards each other with respectively opposite turn directions.