Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kia Silverbrook0
Darrell LaRue McReynolds0
Date of Patent
September 15, 2009
0Patent Application Number
112429160
Date Filed
October 5, 2005
0Patent Primary Examiner
Patent abstract
A process for facilitating modification of an etched trench is provided. The process comprises: (a) providing a wafer comprising an etched trench, the trench having a photoresist plug at its base; and (b) removing a portion of the photoresist by subjecting the wafer to a biased oxygen plasma etch. The process is particularly suitable for preparing a trench for subsequent argon ion milling. Printhead integrated circuits fabricated by a process according to the invention have improved ink channel surface profiles and/or surface properties.
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