US Patent 7589424 Thin silicon based substrate
Patent 7589424 was granted and assigned to Intel on September, 2009 by the United States Patent and Trademark Office.
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Patent Inventor Names
Devendra Natekar0
Sriram Muthukumar0
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Patent abstract
Embodiments of the invention provide a device with a die and a substrate having a similar coefficient of thermal expansion to that of the die. The substrate may comprise a silicon base layer. Build up layers may be formed on the side of the base layer further from the die.
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US Patent 07589424 Thin silicon based substrate US Patent 7589424 Thin silicon based substrate
Infobox
Patent Number
075894240
Patent Number
75894240
Edits on 26 Sep, 2022
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
075894240
Date of Patent
September 15, 2009
0Patent Application Number
122219970
Date Filed
August 8, 2008
0Official Website
Patent Primary Examiner
Edits on 18 Jun, 2022
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US Patent 07589424 Thin silicon based substrate
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07589424
Date of patent
September 15, 2009
Patent application number
12221997
Date Filed
August 8, 2008
Patent primary examiner
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