Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Rajesh V. Iyer0
Shawn D. Knowles0
Date of Patent
September 15, 2009
0Patent Application Number
113431740
Date Filed
January 30, 2006
0Patent Citations Received
Patent Primary Examiner
Patent abstract
An electronic module assembly for an implantable medical device includes a non-conductive block having an opening for accepting a feedthrough conductor. The block has opposite first and second ends and opposite first and second sides. A bond pad is located on the first end of the block for electrical connection to a feedthrough conductor, and the bond pad extends to the first side of the block to provide an electrical connection region there.
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