Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Marvin C. Espino0
Date of Patent
September 22, 2009
Patent Application Number
11490996
Date Filed
July 20, 2006
Patent Primary Examiner
Patent abstract
A thermal conduit to extract heat from an electrical component on a circuit board is disclosed. An electronic assembly according to aspects of the present invention includes an integrated circuit mounted on a circuit board and a thermal conduit having a first and a second portion. The first portion of the thermal conduit is thermally coupled to one or more electrical terminals of the integrated circuit through an opening defined in the circuit board while the second portion of the thermal conduit is thermally coupled to a first material of the circuit board.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
