US Patent 7595131 Connection between a conductive substrate and a laminate

A connection (1) is provided between a conductive substrate, in the form of a planar aluminium terminal (2), and a laminate (3). The laminate has a first plastics layer, in the form of a polymer layer (4), that is secured to terminal (2) and a conductive aluminium layer (5) disposed outwardly from and adjacent to layer (4). The layers (4, 5) terminate at a common circular edge (6) that defines an opening (7) that overlies terminal (2). The connection (1) includes an insulator in the form of a grommet (8) that extends over edge (6) for electrically insulating layer (5) from terminal (2).