Is a
Patent attributes
Current Assignee
0
Patent Jurisdiction
Patent Number
Patent Inventor Names
William Palmteer0
Date of Patent
September 29, 2009
0Patent Application Number
111362490
Date Filed
May 24, 2005
0Patent Primary Examiner
Patent abstract
A surface mount package is provided that includes a first metal layer and a second metal layer configured to be electrically connected to the first metal layer. The surface mount package further includes a ceramic layer between the first and second metal layers. The ceramic layer has an opening therethrough.
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