Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
September 29, 2009
Patent Application Number
12127041
Date Filed
May 27, 2008
Patent Primary Examiner
Patent abstract
An IC package antenna of which a metal radiating member is firstly provided on a base board to form an antenna base board; the antenna base board is formed thereon at least a feed point; and the IC package antenna is packaged with an IC packaging housing and a packaging bottom portion to form an IC chip. The IC packaging housing has a plurality of connecting pins extending outward from inside of itself; wherein the inner end of at least one connecting pin is soldering connected with a feed point of the base board of the antenna. Such an IC package antenna can allow standardized and miniaturized antenna designing, and is applicable to Surface Mount Technology (SMT).
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