US Patent 7595988 Thermal management system and method for electronic assemblies
Patent 7595988 was granted and assigned to Raytheon on September, 2009 by the United States Patent and Trademark Office.
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Patent abstract
According to an embodiment of the present invention, a thermal management system for an electronic assembly includes an electronic component coupled to a substrate, the substrate coupled to a coldplate, a spring member disposed between and engaging both an underside of the electronic component and the coldplate, and a heat transfer element disposed within a chamber formed by the spring member.
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US Patent 07595988 Thermal management system and method for electronic assemblies US Patent 7595988 Thermal management system and method for electronic assemblies
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Patent Number
0759598800
Patent Number
759598800
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Official Website
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
075959880
Date of Patent
September 29, 2009
0Patent Application Number
119354960
Date Filed
November 6, 2007
0Official Website
Patent Primary Examiner
Edits on 23 Sep, 2022
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
075959880
Date of Patent
September 29, 2009
0Patent Application Number
119354960
Date Filed
November 6, 2007
0Official Website
Patent Primary Examiner
Edits on 18 Jun, 2022
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US Patent 07595988 Thermal management system and method for electronic assemblies
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07595988
Date of patent
September 29, 2009
Patent application number
11935496
Date Filed
November 6, 2007
Patent primary examiner
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