A clamp mechanism clamping an electronic device and connecting an object to the electronic device is provided. The mechanism includes a first clamping element, a second clamping element slidably joined to the first clamping element in a joint position to adjust the second clamping element apart from the first clamping element to a clamp distance, a latching element inserted into the joint position to maintain the first clamping element apart from the second clamping element at the clamp distance, and a connecting element joined to the second clamping element and connected to the object.