US Patent 7597816 Wafer bevel polymer removal
Patent 7597816 was granted and assigned to Lam Research on October, 2009 by the United States Patent and Trademark Office.
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Patent abstract
A method of forming a semiconductor device is provided. A wafer with a dielectric layer disposed under a photoresist mask is placed in an etch chamber. The dielectric layer is etched. The wafer is raised. A cleaning gas is provided. A plasma is formed from the cleaning gas. A polymer that has formed on the bevel of the wafer is removed using the plasma from the cleaning gas. The wafer is removed from the etch chamber.
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US Patent 07597816 Wafer bevel polymer removal US Patent 7597816 Wafer bevel polymer removal
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Patent Number
0759781600
Patent Number
759781600
Edits on 27 Apr, 2023
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
075978160
Date of Patent
October 6, 2009
0Patent Application Number
109340810
Date Filed
September 3, 2004
0Official Website
Patent Primary Examiner
Edits on 23 Sep, 2022
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
075978160
Date of Patent
October 6, 2009
0Patent Application Number
109340810
Date Filed
September 3, 2004
0Official Website
Patent Primary Examiner
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US Patent 07597816 Wafer bevel polymer removal
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07597816
Date of patent
October 6, 2009
Patent application number
10934081
Date Filed
September 3, 2004
Patent primary examiner
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