Patent attributes
There is provided a mounting substrate on which a semiconductor chip is mounted using a flip chip bonding, having a plurality of connection pads which are connected to the semiconductor chip, and an insulation layer formed in such a manner as to cover the connection pads partially, wherein the insulation layer includes a first insulation layer which is formed in such a manner as to correspond to a center of the semiconductor chip and a second insulation layer which is formed in such a manner as to surround the first insulation layer, and wherein the plurality of connection pads include first connection pads which are partially covered by the first insulation layer and second connection pads which are partially covered by the second insulation layer.
