Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Koji Yamaguchi0
Yukio Morishige0
Toshio Tsuchiya0
Hiroshi Morikazu0
Ryugo Oba0
Date of Patent
October 13, 2009
Patent Application Number
11826911
Date Filed
July 19, 2007
Patent Primary Examiner
Patent abstract
A wafer laser processing method for forming grooves along streets by applying a pulse laser beam along the streets for sectioning a plurality of devices of a wafer having the plurality of devices which are composed of a laminate consisting of an insulating film and a functional film, on the front surface of a substrate, wherein the pulse laser beam is set to have a repetition frequency of 150 kHz to 100 MHz and an energy per unit length of 5 to 25 J/m.
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