US Patent 7602062 Package substrate with dual material build-up layers
Patent 7602062 was granted and assigned to Altera on October, 2009 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
August 10, 2005
0
Date of Patent
October 13, 2009
0
Patent Application Number
11201515
0
Patent Inventor Names
Wen-Chou Wang
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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