Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
October 20, 2009
Patent Application Number
11142345
Date Filed
June 2, 2005
Patent Citations Received
Patent Primary Examiner
Patent abstract
A method of manufacturing a wafer using a support substrate of a crystalline material. On the surface of the support substrate, a layer of a diamond is grown to form a first wafer in combination with the support substrate. A further substrate is bonded to the surface of the diamond layer, and a region of weakness is formed within the first wafer or the further substrate. Energy is then applied at the region of weakness to detach the structure into a first portion and a second portion.
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