Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Ching-Bai Hwang0
Jin-Gong Meng0
Date of Patent
October 20, 2009
0Patent Application Number
113089160
Date Filed
May 25, 2006
0Patent Primary Examiner
Patent abstract
A heat dissipation device includes a thermal attach block (10), a heat pipe (30) thermally attached to the block, and a fin unit (90) thermally attached to the heat pipe. The block includes a curve-shaped bottom surface (124) allowing it to be thermally attached to a heat generating component (80) to absorb heat therefrom, and a top surface (122) opposite to the bottom surface. The heat pipe includes an evaporating section (32) at one end and a condensing section (34) at the other. The evaporating section can be thermally attached to the top surface of the block. The condensing section can be thermally attached to the fin unit.
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