Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
October 27, 2009
Patent Application Number
11333130
Date Filed
January 17, 2006
Patent Citations Received
Patent Primary Examiner
Patent abstract
A superabsorbent polymer (“SAP”) root dip composition and methods of delivering a SAP to a plant are disclosed. A root structure of a plant may be dipped into a SAP hydrogel. The plant may then be planted, stored or transported for subsequent planting.
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