Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
October 27, 2009
0Patent Application Number
111930650
Date Filed
July 28, 2005
0Patent Primary Examiner
Patent abstract
Bonding and interconnect techniques including a spacer for use with semiconductor die for the creation of thermally efficient, physically compliant Ultra High Vacuum Tubes and the tube resulting therefrom.
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