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US Patent 7608214 Laser beam machining method
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Patent
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Date Filed
October 5, 2005
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Date of Patent
October 27, 2009
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Patent Application Number
11665263
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Patent Citations Received
US Patent 12070875 Silicon carbide wafers with relaxed positive bow and related methods
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US Patent 11654596 Silicon carbide wafers with relaxed positive bow and related methods
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US Patent 11911842 Laser-assisted method for parting crystalline material
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Patent Inventor Names
Koji Kuno
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Tatsuya Suzuki
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
7608214
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Patent Primary Examiner
Philip C. Tucker
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