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US Patent 7608919 Interconnect packaging systems

Patent 7608919 was granted and assigned to University of Notre Dame on October, 2009 by the United States Patent and Trademark Office.

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Patent abstract

The present invention provides a quilt packaging system for microchip, a method for making such a quilt packaging system, microchips that may be used in a such a quilt packaging system, and methods for making such microchips.

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