Patent attributes
A metal film-plating system including an unwinding process part configured to provide a film, a degreasing process part configured to remove impurities from the film, an etching process part configured to perform an etching process on the film, a neutralizing process part configured to perform a neutralizing process on the film, a coupling process part configured to couple the neutralized film with a coupling agent, a catalyst-adding process part configured to adsorb a catalyst onto the coupled film, an underplating process part configured to perform an underplating process on the film, and a plating process part configured to perform a plating process on the film. Further, at least one of the unwinding process part, the degreasing process part, the etching process part, the neutralizing process part, the coupling process part, the catalyst-adding process part, the underplating process part, and the plating process part includes a wetting apparatus configured to perform a wetting operation.
