Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
November 3, 2009
Patent Application Number
11072114
Date Filed
March 4, 2005
Patent Primary Examiner
Patent abstract
A method for spin-on wafer cleaning. The method comprises controlling spin speed and vertical water jet pressure. The vertical jet pressure and the spin speed are substantially maintained in inverse proportion. Wafer spin speed is between 50 to 1200 rpm. Vertical wafer jet pressure is between 0.05 to 100 KPa.
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