US Patent 7611924 Integrated circuit package with chip-side signal connections

Patent 7611924 was granted and assigned to Intel on November, 2009 by the United States Patent and Trademark Office.

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Patent

Patent attributes

Current Assignee

Intel

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

7611924

Date of Patent

November 3, 2009

Patent Application Number

12015985

Date Filed

January 17, 2008

Patent Primary Examiner

‌

Wai-Sing Louie

Patent abstract

Embodiments of the present invention include an apparatus, method, and/or system for an integrated circuit package with signal connections on the chip-side of the package structure.

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