Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
November 10, 2009
Patent Application Number
11532790
Date Filed
September 18, 2006
Patent Primary Examiner
Patent abstract
The present invention discloses a system in package (SIP) integrated circuit and a packaging method thereof. The SIP integrated circuit includes one or more first block dices produced by a first process and one or more second block dices produced by a second process. The first block dices are electrically connected to the second block dices. The first block dices and the second block dices are packaged into a system.
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