US Patent 7615854 Semiconductor package that includes stacked semiconductor die

Patent 7615854 was granted and assigned to International Rectifier (company) on November, 2009 by the United States Patent and Trademark Office.

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Patent Inventor Names

Robert Montgomery0

Date of Patent

November 10, 2009

Patent Application Number

115924070

Date Filed

November 3, 2006

Patent Primary Examiner

Patent abstract

A semiconductor package that includes at least two semiconductor devices that are coupled to one another through a conductive clip.

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