US Patent 7615874 Electronic component module

An electronic component module is provided with a ceramic substrate and a plurality of bonding material applying lands. The ceramic substrate has a rear surface that is substantially rectangular. The plurality of bonding material applying lands are arranged on the rear surface. The plurality of bonding material applying lands includes outer peripheral land rows, each of which is arranged in a line along each side of the rear surface with the exception of corner portions of the rear surface. The plurality of bonding material applying lands includes corner portion inner lands, each of which is arranged on the rear surface at a location that is shifted inwardly in a substantially diagonal direction from the corner portion and is adjacent to the bonding material applying lands closest to the corner portion at ends of the outer peripheral land rows that are arranged in lines along two sides that are connected by the corner portion.