US Patent 7618529 Polishing pad for electrochemical mechanical polishing
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Patent Inventor Names
David B. James0
Joseph G. Ameen0
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Patent abstract
The present invention provides polishing pad for electrochemical mechanical polishing. The pad comprises a cellular polymeric layer overlying a conductive substrate, the cellular polymeric layer having a thickness less than 1.5 mm.
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US Patent 07618529 Polishing pad for electrochemical mechanical polishing US Patent 7618529 Polishing pad for electrochemical mechanical polishing
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Patent Number
076185290
Patent Number
76185290
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Official Website
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Patent Jurisdiction
Patent Number
076185290
Date of Patent
November 17, 2009
0Patent Application Number
108543210
Date Filed
May 25, 2004
0Official Website
Patent Primary Examiner
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US Patent 07618529 Polishing pad for electrochemical mechanical polishing
Infobox
Is a
Patent jurisdiction
Patent number
07618529
Date of patent
November 17, 2009
Patent application number
10854321
Date Filed
May 25, 2004
Patent primary examiner
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