US Patent 7619318 No-flow underfill composition and method
Patent 7619318 was granted and assigned to Intel on November, 2009 by the United States Patent and Trademark Office.
All edits
Edits on 17 Sep, 2023
Golden AI
Edits made to:
Infobox (+4 properties)
Infobox
Patent Inventor Names
Christopher L. Rumer0
Paul A. Koning0
Tian-An Chen0
Vijay Wakharkar0
Edits on 16 Sep, 2023
Golden AI
Edits made to:
Article (+272 characters)
Article
Patent abstract
In some embodiments, a method includes providing a composition which includes a base at least partially filled with filler particles and applying the composition as an underfill composition. At least some of the filler particles are electrically conductive.
Edits on 21 May, 2023
Golden AI
Edits made to:
Infobox (-1 properties)
Infobox
Official Website
Edits on 19 May, 2023
Golden AI
Edits made to:
Infobox (+1/-1 properties)
US Patent 07619318 No-flow underfill composition and method US Patent 7619318 No-flow underfill composition and method
Infobox
Patent Number
076193180
Patent Number
76193180
Edits on 7 Apr, 2023
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
076193180
Date of Patent
November 17, 2009
0Patent Application Number
112385960
Date Filed
September 29, 2005
0Official Website
Patent Primary Examiner
Edits on 18 Jun, 2022
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Website URL
Edits on 3 Dec, 2021
Golden AI
Edits made to:
Infobox (+8 properties)
US Patent 07619318 No-flow underfill composition and method
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07619318
Date of patent
November 17, 2009
Patent application number
11238596
Date Filed
September 29, 2005
Patent primary examiner
Find more entities like US Patent 7619318 No-flow underfill composition and method
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
