US Patent 7622325 Integrated circuit package system including high-density small footprint system-in-package
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Patent Inventor Names
Dario S. Filoteo, Jr.0
IL Kwon Shim0
Seng Guan Chow0
Tsz Yin Ho0
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Patent abstract
An integrated circuit package system including a high-density small footprint system-in-package with a substrate is provided. Passive components are mounted on the substrate. Solder separators are provided on the substrate, the solder separators having flattened tops at a predetermined height above the substrate. A die is supported on the solder separators above the substrate.
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US Patent 07622325 Integrated circuit package system including high-density small footprint system-in-package US Patent 7622325 Integrated circuit package system including high-density small footprint system-in-package
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Patent Number
076223250
Patent Number
76223250
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Patent Jurisdiction
Patent Number
076223250
Date of Patent
November 24, 2009
0Patent Application Number
111637710
Date Filed
October 29, 2005
0Official Website
Patent Primary Examiner
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US Patent 07622325 Integrated circuit package system including high-density small footprint system-in-package
Infobox
Is a
Patent jurisdiction
Patent number
07622325
Date of patent
November 24, 2009
Patent application number
11163771
Date Filed
October 29, 2005
Patent primary examiner
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