US Patent 7622684 Electronic component package
Patent 7622684 was granted and assigned to Panasonic on November, 2009 by the United States Patent and Trademark Office.
All edits
An electronic component package comprises: an electronic component where device elements are mounted inside cavities formed between a component substrate and a component cover that covers the component substrate; and a mounting substrate. The component cover is placed on the mounting substrate, and the electronic component is mounted on the mounting substrate and molded by a resin. At least one of a ground electrode and a dummy electrode is provided on a surface of the component cover, the surface being placed on the mounting substrate. At least one of the ground electrode and the dummy electrode is provided in a position opposed to at least part of the cavities.
US Patent 07622684 Electronic component package US Patent 7622684 Electronic component package
US Patent 07622684 Electronic component package
Find more entities like US Patent 7622684 Electronic component package
