Patent attributes
A power semiconductor module having a housing, a substrate with conductor tracks and power semiconductor components arranged on the conductor tracks, and a connecting device. The connecting device comprises a film composite with first and second conductive layers, which are respectively patterned and thus form conductor tracks, and an insulating layer disposed between the two conductive layers. The first conductive layer has first contacts, formed as spot-welded joints, for power connecting areas of power semiconductor components, second contacts for control connecting areas of power semiconductor components and third contacts for the load connection to a printed circuit board. The second conductive layer connects to the first conductive layer and fourth contacts for providing control connection to an external printed circuit board. The film composite also has film sections between the first and second contacts and between the third and fourth contacts, which are arranged in guide sections of the housing.
