US Patent 7628871 Bulk metallic glass solder material
Patent 7628871 was granted and assigned to Intel on December, 2009 by the United States Patent and Trademark Office.
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Patent Inventor Names
Daewoong Suh0
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Patent abstract
High strength, reliable bulk metallic glass (BMG) solder materials formed from alloys possessing deep eutectics with asymmetric liquidous slopes. BMG solder materials are stronger and have a higher elastic modulus than, and therefore are less likely than crystalline solder materials to damage fragile low k interlayer dielectric (ILD) materials due to thermal stress in materials with different coefficients of thermal expansion (CTE).
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US Patent 07628871 Bulk metallic glass solder material US Patent 7628871 Bulk metallic glass solder material
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Patent Number
076288710
Patent Number
76288710
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Current Assignee
Patent Jurisdiction
Patent Number
076288710
Date of Patent
December 8, 2009
0Patent Application Number
112035460
Date Filed
August 12, 2005
0Official Website
Patent Primary Examiner
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US Patent 07628871 Bulk metallic glass solder material
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07628871
Date of patent
December 8, 2009
Patent application number
11203546
Date Filed
August 12, 2005
Patent primary examiner
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