Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
December 8, 2009
Patent Application Number
11519204
Date Filed
September 12, 2006
Patent Primary Examiner
Patent abstract
A method of bonding a MEMS device to a substrate to form a MEMS device assembly. A thickness profile of the MEMS device and/or the flatness of the mating surface of the substrate is determined. An adhesive is deposited onto a mating surface of the MEMS device and/or the mating surface of the substrate. The mating surfaces of the MEMS device and substrate are brought together, such that the adhesive can bond the MEMS device to the substrate. The volume of adhesive deposited at particular locations on the mating surface is varied to compensate for local variations in the thickness profile of the MEMS device and/or the flatness of the mating surface of the substrate.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
