US Patent 7628879 Conductive scrim embedded structural adhesive films

Systems and methods for providing a structural adhesive film that includes a conductive scrim layer are disclosed. In one embodiment, a method for producing a structural adhesive film includes providing a first resin adhesive layer. The first resin adhesive layer is configured to bind to a first carbon fiber ply. The method also includes providing a second resin adhesive layer. The second adhesive layer is configured to bind to a second carbon fiber ply. The method also includes providing a conductive scrim that is embedded between the first resin adhesive layer and the second resin adhesive layer. In some embodiments, the conductive scrim is infused with resin adhesive.