Patent attributes
A diode disposed on a substrate is provided. The diode includes a semiconductor pattern, a first conductor pattern, a second conductor pattern, an insulating layer, and a top conductor pattern. The first conductor pattern and the second conductor pattern are respectively disposed on a portion of the semiconductor pattern. The insulating layer is disposed on the first conductor layer, the second conductor layer, and the semiconductor pattern. Moreover, the top conductor pattern is disposed on the insulating layer above the semiconductor pattern and electrically connected to the first conductor pattern. In the diode mentioned above, no circuit belonging to the diode is disposed under the semiconductor pattern. Therefore, when the aforementioned diode and other devices are integrated, layout of the devices can adopt the space under the diode.
