Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Takashi Fujita0
Date of Patent
December 15, 2009
0Patent Application Number
118070690
Date Filed
May 25, 2007
0Patent Citations Received
Patent Primary Examiner
Patent abstract
An object of the present invention is to provide a polishing method and a polishing apparatus that can secure an even polished shape and can remove slurry that has contributed to polishing and contains polishing by-product to the outside of a pad efficiently to reduce scratches due to the polishing by-product, and can suppress consumption of slurry to the minimum to realize cost reduction during running for mass production.
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