Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Tetsuya Iida0
Masahiro Katsumura0
Date of Patent
December 15, 2009
0Patent Application Number
105531760
Date Filed
April 7, 2004
0Patent Primary Examiner
Patent abstract
The present invention relates to a stamper used for an injection molding of a resin material and a manufacturing method thereof. It is provided with such stamper as being excellent in durability in use without causing corrosion at a portion contacting with the resin material, wherein an anti-corrosion film made of any one of alloy selected from a nickel alloy, a silver alloy or a copper alloy is formed on a surface of the stamper contacting with the resin material. Further, it is provided with a method comprising steps of: forming anti-corrosion film on the surface of a mold for manufacturing the stamper; forming the stamper on the anti-corrosion film; and separating the stamper and the anti-corrosion film in a body from the mold.
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