Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
December 15, 2009
0Patent Application Number
123455030
Date Filed
December 29, 2008
0Patent Citations Received
...
Patent Primary Examiner
Patent abstract
A method includes steps of providing first and second substrates, and forming a bonding interface between them using a conductive bonding region. A portion of the second substrate is removed to form a mesa structure. A vertically oriented semiconductor device is formed with the mesa structure. A portion of the conductive bonding region is removed to form a contact. The vertically oriented semiconductor device is carried by the contact.
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